Discover our new UQD and UQDB series, OCP compliant
Faster at Tech Show Asia 2026 in Singapore
Where thermal reliability takes shape
Faster Thermal Management will debut at Tech Show Singapore, on September 29-30, presenting its latest solutions for datacenter liquid cooling.
This event is an opportunity to experience our dedicated thermal portfolio, engineered to support safe, scalable and predictable cooling architectures.
Visitors will be able to explore all our range of products, including UQD and UQDB Series, designed in compliance with OCP guidelines, ensuring clean operation, reduced operational risk and reliable performance in high-density environments.
On-site experience
At our stand, you will have the opportunity to engage directly with the Faster Thermal Management team and explore how our solutions are developed around real application requirements.
Our engineers will be available to
• Present product architectures and application use cases • Discuss system requirements and integration scenarios • Introduce our co-design approach for tailored thermal solutions • Provide guidance on selecting the right components for your systems
Request and book a meeting
Schedule your visit.